mcl_gb_2013_web - page 61

61
WISSENSBILANZ
ANHANG
B) Konferenzbeiträge
www.mcl.at 61
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Autor
Co-Autor
Titel Konferenztitel Konferenz
Schöngrundner, R.;
Cordill, M.J.;
Berger, J.;
Krückl, H.P.;
Fellner, K.;
Krivec, T.;
Kurz, M.;
Fuchs, P.F. &
Maier, G.A.
Adhesion of printed circuit boards
with bending and the effect of reflow
cycles
Proceedings
of the14th
International
Conference
on Thermal,
Mechanical and
Multi-Physics
Simulation and
Experiments in
Microelectronics
and Microsystems
14th International
Conference
on Thermal,
Mechanical and
Multi-Physics
Simulation and
Experiments in
Microelectronics
and Microsystems
(EuroSimE 2013)
Stoschka, M.;
Leitner, M. &
Barsoum, Z.
Study of the local notch stress HFMI
master S/N-curve approach on high-
strength steel joints
Proceedings of
the 2nd Swedish
conference
on design and
fabrication of welded
structures
2nd Swedish
Conference
on Design and
Fabrication of
Welded Structures
Stoschka, M.;
Ottersböck, M. &
Leitner, M.
Studie des transienten
Verfestigungsverhaltens für ein- und
mehrlagige Verbindungen
Simulationsforum
FWS
Simulationsforum
Schweißen und
Wärmebehandlung
(FWS)
Teppernegg, T.;
Klünsner, T.;
Tritremmel, C.;
Czettl, C.;
Keckes, J.;
Wroblewski, T.;
Ebner, R. &
Pippan, R.
Spatial correlation of tensile residual
stress and thermal fatigue damage
in coated cemented carbide milling
inserts
Proceedings of the
18th International
Plansee Seminar
18th International
Plansee Seminar