Publications
- Ideal compressive strength of fcc Co, Ni, and Ni-rich alloys along the (001) direction: A first-principles study (Artikel)
Breidi A., Fries S.G., Ruban A.V.
Physical Review B (2016)
Externer Link:Link - The mechanics of tessellations – Bioinspired strategies for fracture resistance (Artikel)
Fratzl, P. and Kolednik, O. and Fischer, F.D. and Dean, M.N.
Chemical Society Reviews (2016)
Externer Link:Link - Impact of local magnetism on stacking fault energies: A first-principles investigation for fcc iron (Artikel)
Bleskov I., Hickel T., Neugebauer J., Ruban A.
Physical Review B (2016)
Externer Link:Link - About the fatigue crack propagation threshold of metals as a design criterion – A review (Artikel)
Zerbst, U. and Vormwald, M. and Pippan, R. and Gänser, H.P. and Sarrazin-Baudoux, C. and Madia, M.
Engineering Fracture Mechanics (2016)
Externer Link:Link - Atomic configuration and properties of austenitic steels at finite temperature: Effect of longitudinal spin fluctuations (Artikel)
Ruban A.V., Dehghani M.
Physical Review B (2016)
Externer Link:Link - X-ray nanodiffraction analysis of stress oscillations in a W thin film on through-silicon via (Artikel)
Todt J., Hammer H., Sartory B., Burghammer M., Kraft J., Daniel R., Keckes J., Defregger S.
Journal of Applied Crystallography (2016)
Externer Link:Link - Microscopic texture characterisation in piezoceramics (Artikel)
Deluca, M.
Advances in Applied Ceramics (2016)
Externer Link:Link - A novel approach for evaluation of material interfaces in electronics (Artikel)
Khatibi G., Czerny B., Lassnig A., Lederer M., Nicolics J., Magnien J., Suhir E.
IEEE Aerospace Conference Proceedings (2016)
Externer Link:Link - Reliable 300 mm Wafer Level Hybrid Bonding for 3D Stacked CMOS Image Sensors (Artikel)
Lhostis S., Farcy A., Deloffre E., Lorut F., Mermoz S., Henrion Y., Berthier L., Bailly F., Scevola D., Guyader F., Gigon F., Besset C., Pellissier S., Gay L., Hotellier N., Le Berrigo A.-L., Moreau S., Balan V., Fournel F., Jouve A., Cheramy S., Arnoux M., Rebhan B., Maier G.A., Chitu L.
Proceedings - Electronic Components and Technology Conference (2016)
Externer Link:Link - 200 nm Wafer-to-wafer overlay accuracy in wafer level Cu/SiO2 hybrid bonding for BSI CIS (Artikel)
Rebhan B., Bernauer M., Wagenleitner T., Heilig M., Kurz F., Lhostis S., Deloffre E., Jouve A., Balan V., Chitu L.
Proceedings of the Electronic Packaging Technology Conference, EPTC (2016)
Externer Link:Link - Accelerated thermo-mechanical test method for LED modules (Artikel)
Magnien J., Rose J., Pfeiler-Deutschmann M., Hammer R., Mitterhuber L., Defregger S., Schrank F., Kraker E.
2016 17th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2016 (2016)
Externer Link:Link - Fracture and material behavior of thin film composites (Artikel)
Kozic D., Treml R., Maier-Kiener V., Schöngrundner R., Brunner R., Kiener D., Antretter T., Gänser H.-P.
2016 17th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2016 (2016)
Externer Link:Link - Characterization of polyimid-multi-layer thin films combining laser ultrasonic measurements and numerical evaluations (Artikel)
Grünwald E., Nuster R., Hammer R., Aßmann H., Paltauf G., Brunner R.
2016 17th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2016 (2016)
Externer Link:Link - Towards condition monitoring of railway points: Instrumentation, measurement and signal processing (Artikel)
Kollment W., O'Leary P., Harker M., Osberger U., Eck S.
Conference Record - IEEE Instrumentation and Measurement Technology Conference (2016)
Externer Link:Link - Investigation of the temperature-dependent heat path of an LED module by thermal simulation and design of experiments (Artikel)
Mitterhuber L., Defregger S., Hammer R., Magnien J., Schrank F., Hörth S., Hutter M., Kraker E.
THERMINIC 2016 - 22nd International Workshop on Thermal Investigations of ICs and Systems (2016)
Externer Link:Link - Ab initio modeling of decomposition in iron based alloys (Artikel)
Gorbatov O.I., Gornostyrev Y.N., Korzhavyi P.A., Ruban A.V.
Physics of Metals and Metallography (2016)
Externer Link:Link - Dynamic finite element model-impact force and contact pressure for measured geometries of fixed crossings (Artikel)
Pletz M., Ossberger U., Ossberger H., Daves W.
The Dynamics of Vehicles on Roads and Tracks - Proceedings of the 24th Symposium of the International Association for Vehicle System Dynamics, IAVSD 2015 (2016)
Externer Link:Link - Gas Sensor Devices based on CuO- and ZnO- Nanowires directly synthesized on silicon substrate (Artikel)
Wimmer-Teubenbacher R., Lackner E., Krainer J., Steinhauer S., Koeck A.
MRS Advances (2016)
Externer Link:Link - Calculation of crack driving forces of surface cracks subjected to rolling/sliding contact (Artikel)
Kracalik, M. and Daves, W. and Antretter, T.
Engineering Fracture Mechanics (2016)
Externer Link:Link - Influence of subcritical crack growth on the determination of fracture toughness in brittle materials (Artikel)
Krautgasser, C. and Chlup, Z. and Supancic, P. and Danzer, R.
Journal of the European Ceramic Society (2016)
Externer Link:Link