Materials for Microelectronics

The MCL division „Materials for Microelectronics" concentrates its research activities on material based solutions for the microelectronics industry and has a wide-range of methods and a broad expertise in material characterisation as well as in numerical simulation of materials-, processes- and components at all length scales at its disposal. The research concentrates on (1) materials for 3D integration and packaging, (2) materials and algorithms for sensor technology, compatible with CMOS technology, (3) simulation-based „design for reliability“ and „condition monitoring“ and (4) method development for material characterisation and reliability analysis.

Our Team

Heads of Areas

Executive Lead Internal-/External Services

Barbara Kosednar-Legenstein (Details)

Team Leaders

Scientific Staff

PhDs and Project Staff

Florentyna Sosada-Ludwikowska (Details)
Franz-Martin Frieß (Details)
Lisa Mitterhuber-Gressl (Details)