Publications
- Influence of the Parameters of Induction Heat Treatment on the Mechanical Properties of 50CrMo4 (Artikel)
V. JÁSZFI, P. PREVEDEL, A. EGGBAUER, Y. GODAI, P. RANINGER, D. MEVEC, M. PANZENBÖCK, R. EBNER
HTM (2019)
Externer Link:Link - In-situ fracture of elastic-plastic interfaces in microelectronic devices (Artikel)
M. Alfreider, O. Kolednik, D. Kiener
TMS (2019)
Externer Link:Link - In-situ investigation of the oxidation behavior of metastable CVD Ti1‑xAlxN using a novel combination of synchrotron XRD and DSC (Artikel)
Saringer, Tkadletz, Stark, Czettl, Schalk
Surface & Coatings Technology (2019)
Externer Link:Link - In-Situ Temperature Measurement on CMOS Integrated Micro-Hotplates for Gas Sensing Devices (Artikel)
Deluca, M., Wimmer-Teubenbacher, R., Mitterhuber, L., Mader, J., Rohracher, K., Holzer, M., Köck, A.
Sensors (2019)
Externer Link:Link - Inverse model for the control of induction heat treatments (Artikel)
Asadzadeh, Mohammad Zhian; Raninger, Peter; Prevedel, Petri; Ecker, Werner; Mücke, Manfred
Materials (2019)
Externer Link:Link - Investigation of Deformation Mechanisms in an Austenitic Mn-Steel by means of Scanning Electron Microscopy and Electron Backscatter Diffraction (Artikel)
C. Hahn, M. Lukas, G. Ressel, T. Klein, and R. Ebner
Practical Metallography (2019)
Externer Link:Link - Investigation of deformation mechanisms in manganese steel crossings using FE models (Artikel)
Julian Wiedorn; Werner Daves; Uwe Ossberger; HeinzOssberger; Martin Pletz
Tribology International (2019)
Externer Link:Link - Investigation on Thermo-Physical Properties of 500 nm CVD Grown Tungsten Layers using Time Domain Thermoreflectance and Scanning Thermal Microscopy (Artikel)
Katrin Fladischer, Lisa Mitterhuber, Verena Leitgeb, Stefan Defregger, Jürgen Spitaler
Therminic 2019 (2019)
Externer Link:Link - Live observation of nanoscopic stress concentrations and transformation fronts in nickel-titanium using in-situ synchrotron 200nm X-ray diffraction coupled with indentation (Artikel)
J. Keckes
Shape Memory and Superelastic Technology Conference and Exposition (2019)
Externer Link:Link - Local approach for coarsening of precipitates (Artikel)
J. Svoboda, Y.V. Shan, G.A. Zickler, E. Kozeschnik, F.D. Fischer
Scripta Materialia (2019)
Externer Link:Link - Mechanism and Control Parameters of the Metal-Insulator Transition in Nickelates (Artikel)
O.E. Peil, A. Hampel, C. Ederer, A. Georges
Physical Review Letters (2019)
Externer Link:Link - Mechanosynthesis of the Whole Y1−xBixMn1−xFexO3 Perovskite System: Structural Characterization and Study of Phase Transitions. (Artikel)
Quintana-Cilleruelo, J.Á.; K. Veerapandiyan, V.; Deluca, M.; Algueró, M.; Castro, A.
Materials (2019)
Externer Link:Link - Microstructure and mechanical properties of CVD TiN/TiBN multilayer coatings (Artikel)
Christina Kainz, Nina Schalk, Michael Tkadletz, Christian Mitterer, Christoph Czettl
Surface and Coatings Technology (2019)
Externer Link:Link - Model-based interpretation of thermal desorption spectra of Fe-C-Ti alloys (Artikel)
A. Drexler, T. Depover, K. Verbeken, W. Ecker
Journal of Alloys and Compounds (2019)
Externer Link:Link - Modeling of Diffusion and Incorporation of Interstitial Oxygen Ions at the TiN/SiO2 Interface (Artikel)
Jonathon Cottom, Anton Bochkarev, Emilia Olsson, Kamal Patel, Manveer Munde, Jürgen Spitaler, Maxim N Popov, Michel Bosman, Alexander L Shluger
ACS Applied Materials & Interfaces (2019)
Externer Link:Link - Modeling of the secondary refining process of steel (Artikel)
You, Michelic, Bernhard
4th European Steel Technology and Application Days (ESTAD) 2019 (2019)
Externer Link:Link - Numerical study on local effects of composition and geometry in self-healing solders (Artikel)
Georg Siroky ; Elke Kraker ; Julien Magnien ; Ernst Kozeschnik ; Dietmar Kieslinger ; Werner Ecker
IEEE (2019)
Externer Link:Link - Package Level Warpage Simulation of a Fan Out System in Board Module (Artikel)
M. Frewein ; T. Krivec ; Q. Tao ; J. Zuendel ; J. Rosc ; M. Gschwandl ; Peter F. Fuchs
Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) (2019)
Externer Link:Link - Thermodynamic and mechanical stability of Ni3X-type intermetallic compounds (Artikel)
Nada Kulo, Shuang He, Werner Ecker, Reinhard Pippan, Thomas Antretter, Vsevolod I. Razumovskiy
Intermetallics (2019)
Externer Link:Link - Quantitative SThM Characterization for Heat Dissipation Through Thin Layers (Artikel)
Verena Leitgeb; Katrin Fladischer; Lisa Mitterhuber; Stefan Defregger
Therminic 2019 (2019)
Externer Link:Link