Publikationen




Gruppe:
Materials Engineering
Microelectronics
Process Engineering
Product Engineering
Steels / Non- Ferrous Metals
Structural Components
Tooling
  • Ultrafast artificial aging of Al-Mg-Si alloys (Artikel)
    Werinos M., Antrekowitsch H., Kozeschnik E., Ebner T., Moszner F., Löffler J.F., Uggowitzer P.J., Pogatscher S.
    Scripta Materialia (2016)
    Externer Link:Link
  • Conductivity relaxation experiments on donor doped barium titanate ceramics: Effect of microstructure (Artikel)
    Preis W., Sitte W.
    Solid State Ionics (2016)
    Externer Link:Link
  • Al-rich cubic Al0.8Ti0.2N coating with self-organized nano-lamellar microstructure: Thermal and mechanical properties (Artikel)
    Todt J., Zalesak J., Daniel R., Pitonak R., Köpf A., Weißenbacher R., Sartory B., Mitterer C., Keckes J.
    Surface and Coatings Technology (2016)
    Externer Link:Link
  • Application of 2D finite element analysis to compare cracking behaviour in twin-disc tests and full scale wheel/rail experiments (Artikel)
    Kráčalík M., Trummer G., Daves W.
    Wear (2016)
    Externer Link:Link
  • Curvature determination of embedded silicon chips by in situ rocking curve X-ray diffraction measurements at elevated temperatures (Artikel)
    Angerer P., Schöngrundner R., Macurova K., Wiessner M., Keckes J.
    Powder Diffraction (2016)
    Externer Link:Link
  • In-situ Observation of Cross-Sectional Microstructural Changes and Stress Distributions in Fracturing TiN Thin Film during Nanoindentation (Artikel)
    Zeilinger A., Todt J., Krywka C., Müller M., Ecker W., Sartory B., Meindlhumer M., Stefenelli M., Daniel R., Mitterer C., Keckes J.
    Scientific Reports (2016)
    Externer Link:Link
  • The mechanics of tessellations-bioinspired strategies for fracture resistance (Artikel)
    Fratzl P., Kolednik O., Fischer F.D., Dean M.N.
    Chemical Society Reviews (2016)
    Externer Link:Link
  • Chiral fermion dynamics in 2d magnetic vortices: Manifestation of momentum-spin-locking (Artikel)
    Pötz W., Hammer R.
    Journal of Applied Physics (2016)
    Externer Link:Link
  • A thermokinetic model for Mg-Si couple formation in Al-Mg-Si alloys (Artikel)
    Svoboda J., Shan Y.V., Kozeschnik E., Fischer F.D.
    Modelling and Simulation in Materials Science and Engineering (2016)
    Externer Link:Link
  • Ab initio search for cohesion-enhancing impurity elements at grain boundaries in molybdenum and tungsten (Artikel)
    Scheiber D., Pippan R., Puschnig P., Romaner L.
    Modelling and Simulation in Materials Science and Engineering (2016)
    Externer Link:Link
  • International Conference on Materials, Processing and Product Engineering 2015 (MPPE2015) (Artikel)
    Eck S., Ludwig A., Ebner R.
    IOP Conference Series: Materials Science and Engineering (2016)
    Externer Link:Link
  • Investigation of the influence of the chemical composition of HSLA steel grades on the microstructure homogeneity during hot rolling in continuous rolling mills using a fast layer model (Artikel)
    Schmidtchen M., Rimnac A., Warczok P., Kozeschnik E., Bernhard C., Bragin S., Kawalla R., Linzer B.
    IOP Conference Series: Materials Science and Engineering (2016)
    Externer Link:Link
  • State parameter-based modelling of microstructure evolution in micro-alloyed steel during hot forming (Artikel)
    Buken H., Kozeschnik E.
    IOP Conference Series: Materials Science and Engineering (2016)
    Externer Link:Link
  • Ideal compressive strength of fcc Co, Ni, and Ni-rich alloys along the (001) direction: A first-principles study (Artikel)
    Breidi A., Fries S.G., Ruban A.V.
    Physical Review B (2016)
    Externer Link:Link
  • Impact of local magnetism on stacking fault energies: A first-principles investigation for fcc iron (Artikel)
    Bleskov I., Hickel T., Neugebauer J., Ruban A.
    Physical Review B (2016)
    Externer Link:Link
  • Atomic configuration and properties of austenitic steels at finite temperature: Effect of longitudinal spin fluctuations (Artikel)
    Ruban A.V., Dehghani M.
    Physical Review B (2016)
    Externer Link:Link
  • X-ray nanodiffraction analysis of stress oscillations in a W thin film on through-silicon via (Artikel)
    Todt J., Hammer H., Sartory B., Burghammer M., Kraft J., Daniel R., Keckes J., Defregger S.
    Journal of Applied Crystallography (2016)
    Externer Link:Link
  • A novel approach for evaluation of material interfaces in electronics (Artikel)
    Khatibi G., Czerny B., Lassnig A., Lederer M., Nicolics J., Magnien J., Suhir E.
    IEEE Aerospace Conference Proceedings (2016)
    Externer Link:Link
  • Reliable 300 mm Wafer Level Hybrid Bonding for 3D Stacked CMOS Image Sensors (Artikel)
    Lhostis S., Farcy A., Deloffre E., Lorut F., Mermoz S., Henrion Y., Berthier L., Bailly F., Scevola D., Guyader F., Gigon F., Besset C., Pellissier S., Gay L., Hotellier N., Le Berrigo A.-L., Moreau S., Balan V., Fournel F., Jouve A., Cheramy S., Arnoux M., Rebhan B., Maier G.A., Chitu L.
    Proceedings - Electronic Components and Technology Conference (2016)
    Externer Link:Link
  • 200 nm Wafer-to-wafer overlay accuracy in wafer level Cu/SiO2 hybrid bonding for BSI CIS (Artikel)
    Rebhan B., Bernauer M., Wagenleitner T., Heilig M., Kurz F., Lhostis S., Deloffre E., Jouve A., Balan V., Chitu L.
    Proceedings of the Electronic Packaging Technology Conference, EPTC (2016)
    Externer Link:Link
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