Schädigung in Multimaterial-Verbunden

  1. J. Magnien, J. Rosc, M. Pfeiler-Deutschmann, R. Hammer, L. Mitterhuber, S. Defregger, F. Schrank, E Kraker, Accelerated thermo-mechanical test method for LED modules, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE). IEEE (2016)
  2. N.K. Simha, F.D. Fische, G.X. Shan, C.R. Chen, O. Kolednik, J-integral and crack driving force in elastic–plastic materials, Journal of the Mechanics and Physics of Solids 56 (2008) 2876–2895
  3. W. Ochensberger, O. Kolednik, Physically appropriate characterization of fatigue crack propagation rate in elastic–plastic materials using the J-integral concept, International Journal of Fracture 192 (2015), 25-45
  4. O. Kolednik, J. Predan, R.D. Fischer, P. Fratzl, Bioinspired Design Criteria for Damage-Resistant Materials with Periodically Varying Microstructure, Advanced Functional Materials (2011), 3634-3641
  5. M. Sistaninia, O. Kolednik, Effect of a single soft interlayer on the crack driving force. Engineering Fracture Mechanics 130 (2014) 21-41
  6. L. B. Freund and S. Suresh, Thin film materials: stress, defect formation and surface evolution, Cambridge University Press (2004)

Thermisches Management

  1. L. Mitterhuber, S. Defregger, R. Hammer, J. Magnien, F. Schrank, S. Hörth, M. Hutter, E. Kraker, Investigation of the Temperature-Dependent Heat Path of an LED Module by Thermal Simulation and Design of Experiments, Therminic 2016, 22nd International Workshop Thermal Investigations of ICs and Systems.

Simulationsunterstütze Materialcharakterisierung

  1. E. Grünwald, J. Rosc, R. Hammer, P. Czurratis, M. Koch, J. Kraft, F Schrank, R. Brunner, Automatized failure analysis of tungsten coated TSVs via scanning acoustic microscopy, Microelectronics Reliability (2016)
  2. E. Grünwald, R. Hammer, J. Rosc, G. A. Maier, M. Bärnthaler, M. J. Cordill, S. Brand, R. Nuster, T. Krivec, R Brunner, Advanced 3D Failure Characterization in Multi-Layered PCBs, NDT&E International 84 (2016) 99-107
  3. E. Grünwald, R. Nuster, R. Hammer, H. Aymann, G. Paltauf, R. Brunner, Characterization of polyimid-multi-layer thin films combining laser ultrasonic measurements and numerical evaluations, 17th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE). IEEE (2016)
  4. E. Grünwald, R. Nuster, R. Treml, D. Kiener, G. Paltauf and R. Brunner, "Young’s Modulus and Poisson’s Ratio Characterization of Tungsten Thin Films via Laser Ultrasound," Materials Today: Proceedings 2, p. 4289 – 4294, 2015
  5. R. Schöngrundner, R. Treml, T. Antretter, D. Kozic, W. Ecker, D. Kiener and R. Brunner, "Critical assessment of the determination of residual stress profiles in thin films by means of the ion beam layer removal method," Thin Solid Films 564, pp. 321-330, 2014
  6. M. Deluca, R. Hammer, J. Keckes, J. Kraft, F. Schrank, J.Todt , O. Robach , J-S. Micha, S. Defregger, Integrated experimental and computational approach for residual stress investigation near through-silicon vias, submitted to Journal of Applied Physics (2016)
  7. J. Todt. H. Hammer, B. Sartory, M. Burghammer, J. Kraft, R. Daniel, S. Defregger, X-ray nanodiffraction analysis of stress oscillations in a W thin film on through-silicon via, Journal of applied crystallography 49 (2016)
  8. R. Treml, D. Kozic, R. Schöngrundner, O. Kolednik, H.-P. Gänser, R. Brunner, D. Kiener, Miniaturized fracture experiments to determine the toughness of individual films in a multilayer system, Extreme Mechanics Letters (2016)