Newsbeitrag

New Paper: AI-Assisted Acoustic Interferometry - New Possibilities for Failure Analysis of 3D Interconnect Technologies by Group Brunner Material & Damage Analytics

Advanced device miniaturization strongly impacts failure analysis (FA), since it triggers the need for non-destructive approaches with high resolution in combination with cost and time efficient execution. Acoustic interferometry provides sufficient penetration depth and high resolution for FA .

For more information, please visit: www.nature.com/articles/s44172-024-00247-8