We specialise in the preparation of microelectronic components for further investigations by SEM, CT, SAM, AFM or light microscopy.

Our main focus/competences

  • Preparation of printed circuit boards (PCBs)
  • Preparation of LED-modules/LED-chips for further investigations such as the packaging technology or wire bonds
  • Preparation of TSVs (Through Silicon Vias)
  • Preparation of micro hot plates for the evaluation of underetchings
  • Documentation by light microscopy