We offer the thermal characterisation of packages for semiconductor devices like integrated circuits (ICs) or Power-LEDs.
- Reconstruction of heat flows in complex electronic components
- Thermal evaluation of packages
- Thermal behaviour of 3D-integrated electronic components
- Thermal dissipation behaviour of Power-LEDs
- Failure mode analysis in-situ and non-destructive
- Verification of simulations concerning the thermal behaviour
- In-situ thermal live-mode testing of electronic components