We offer the thermal characterisation of packages for semiconductor devices like integrated circuits (ICs) or Power-LEDs.

  • Reconstruction of heat flows in complex electronic components
  • Thermal evaluation of packages
  • Thermal behaviour of 3D-integrated electronic components
  • Thermal dissipation behaviour of Power-LEDs
  • Failure mode analysis in-situ and non-destructive
  • Verification of simulations concerning the thermal behaviour
  • In-situ thermal live-mode testing of electronic components