We specialise in the preparation of microelectronic components for further investigations by SEM, CT, SAM, AFM or light microscopy.
Our main focus/competences
- Preparation of printed circuit boards (PCBs)
- Preparation of LED-modules/LED-chips for further investigations such as the packaging technology or wire bonds
- Preparation of TSVs (Through Silicon Vias)
- Preparation of micro hot plates for the evaluation of underetchings
- Documentation by light microscopy
