We characterise the mechanical properties of different materials used for the manufacturing of microelectronic components as well as simple and complex components.
Our main focus/competences
Determination of interfacial resistances on different materials via shear tests, peel tests, double-cantilever beam tests
Reliability tests (creep tests, cyclic loading)
Characterisation of wire bonds (pull tests of wires with a thickness from 20 up to 400 µm, shear tests, etc.)
3-point and 4-point bending tests up to 1000 N for different materials (wafers, PCBs, etc.)